Sing H. Lee
Office: 3409 Engineering Building Unit 1
Department of Electrical and Computer Engineering
9500 Gilman Drive, Mail Code 0407
University of California, San Diego
La Jolla, CA 92093-0407
Phone: (858) 534-2413
Fax: (858) 534-1225
Ph.D. University of California, Berkeley, 1968
Optoelectronics and Applied Opticsl
Professor Lee joined the faculty at UC San Diego in January 1974, after
having taught at Carnegie Mellon University. He has published more than
125 refereed papers in professional journals, edited special issues of
Applied Optics and Optical Engineering, edited books for Springer Verlag,
SPIE Critical Review series and Milestone series, and contributed several
chapters to other books. He was the chairman of the optical processing
group of IEEE Computer Society 1986-88, program chairs of several
professional conferences, including three on computer generated holography
(1983, 1988, 1993) one on optical computing (1991) and one on spatial light
Optoelectronic packaging technology and CAD; 3D stacked MCMS; integration
of micro-optics, micro-mechanics and microelectronics modules for optical
interconnects; design, fabrication and replication of microoptics; design,
fabrication and testing of small spatial light modulators and optoelectronic
chip sets for optical interconnects; volumetric display and optical memory.
Honors and Distinctions
Fellow of the Optical Society of America, 1983
Fellow of the International Society of Optical Engineering, 1990
W. Daschner, M. Larsson, and S. H. Lee, "Fabrication of Monolithic Diffractive Optical Elements by the Use of E-beam Direct Write on an Analog Resist and a Single Chemically Assisted Ion-beam Etching Step," Appl. Opt., 34(14), 2534-2539 (May 10, 1995).
M. S. Jin, J. H. Wang, V. Ozguz, and S. H. Lee, "Direct-bonding and Flip-chip Bonding Technologies Applied to Si/PLZT Spatial Light Modulator Fabrication," Proc. 45th Electronic Components & Technology Conference (Las Vegas 1995), pp. 194-200.
S.K. Patra, J. Ma, V. H. Ozguz, and S. H. Lee, "Alignment Issues in Packaging for Free-Space Optical Interconnects," Opt. Eng., 33(5), 1561-1570 (1994).
Last Updated: 5/3/97